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2010-08-12 rev.1.0 TLP2408 1 photocouplers gaa ? as infrared led & photo ic TLP2408 TLP2408 TLP2408 TLP2408 1. 1. 1. 1. applications applications applications applications ? high-speed digital interfacing for instrumentation and control devices ? communications equipment ? intelligent power module signal isolation 2. 2. 2. 2. general general general general the toshiba TLP2408 consists of a gaa ? as light-emitting diode coupled with a high-gain, high-speed photo detector. it is housed in the 8-pin so8 package. the detector has a totem-pole output stage with current sourcing and sinking capabilities. the TLP2408 has an internal faraday shield that provides a guaranteed common-mode transient immunity of 15 kv/ s. the TLP2408 has an inverter output. a logic buffer output version, the tlp2405, is also available. 3. 3. 3. 3. features features features features (1) inverter logic type (totem pole output) (2) package: so8 (3) supply voltage: 4.5 to 20 v (4) threshold input voltage, low to high: i fhl = 1.6 ma (max) (5) propagation delay time: t phl /t plh = 250 ns (max) (6) common-mode transient immunity: 15 kv/ s (min) (7) operating temperature: -40 to 100 (8) isolation voltage: 3750 vrms (min) (9) safety standard ul-approved: ul1577 file no.e67349 cul-approved: csa component acceptance service no.5a, file no.e67349 vde-approved: option (v4) en60747-5-2 (note) (note) (note) (note) note: when an en60747-5-2 approved type is needed, please designate the option (v4) option (v4) option (v4) option (v4) . 4. 4. 4. 4. packaging and pin configuration packaging and pin configuration packaging and pin configuration packaging and pin configuration 1: nc 2: anode 3: cathode 4: nc 5: gnd 6: v o (output) 7: nc 8: v cc so8
2010-08-12 rev.1.0 TLP2408 2 5. 5. 5. 5. internal circuit (note) internal circuit (note) internal circuit (note) internal circuit (note) fig. fig. fig. fig. 5.1 5.1 5.1 5.1 internal circuit internal circuit internal circuit internal circuit note: a 0.1- f bypass capacitor must be connected between pin 8 and pin 5. 6. 6. 6. 6. principle of operation principle of operation principle of operation principle of operation 6.1. 6.1. 6.1. 6.1. truth table truth table truth table truth table input h l led on off output l h 6.2. 6.2. 6.2. 6.2. mechanical parameters mechanical parameters mechanical parameters mechanical parameters characteristics creepage distances clearance internal isolation thickness min 4.0 4.0 unit mm
2010-08-12 rev.1.0 TLP2408 3 7. 7. 7. 7. absolute maximum ratings (note) absolute maximum ratings (note) absolute maximum ratings (note) absolute maximum ratings (note) unless otherwise specified, t a = 25 led detector common characteristics forward current forward current derating reverse voltage power dissipation power dissipation derating output current output current output voltage supply voltage operating temperature storage temperature lead soldering temperature isolation voltage (t a 85 ) (t a 85 ) (t a 85 ) (t a 25 ) (t a = 100 ) (10 s) ac, 1 min, r.h. 60% symbol i f ? i f / v r p d ? p d / i o i o v o v cc t opr t stg t sol bv s note (note 1) rating 25 -0.67 5 40 -1.0 25/-15 5/-5 -0.5 to 20 -0.5 to 20 -40 to 100 -55 to 125 260 3750 unit ma ma/ v mw mw/ ma v vrms note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook ("handling precautions"/"derating concept and methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 1: this device is considered as a two-terminal device: pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 8. 8. 8. 8. recommended operating conditions (note) recommended operating conditions (note) recommended operating conditions (note) recommended operating conditions (note) characteristics input on-state current input off-state voltage supply voltage operating temperature symbol i f(on) v f(off) v cc t opr note (note 1) min 2 0 4.5 -40 typ. max 10 0.8 20 100 unit ma v note: the recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. each parameter is an independent value. when creating a system design using this device, the electrical characteristics specified in this datasheet should also be considered. note: a ceramic capacitor (0.1 f) should be connected between pin 8 and pin 5 to stabilize the operation of a high- gain linear amplifier. otherwise, this photocoupler may not switch properly. the bypass capacitor should be placed within 1 cm of each pin. note 1: denotes the operating range, not the recommended operating condition.
2010-08-12 rev.1.0 TLP2408 4 9. 9. 9. 9. electrical characteristics (note) electrical characteristics (note) electrical characteristics (note) electrical characteristics (note) unless otherwise specified, t a = -40 to 100 , v cc = 4.5 to 20 v characteristics input forward voltage input temperature coefficient of forward voltage input reverse current input capacitance low-level output voltage high-level output voltage low-level supply current high-level supply current low-level short-circuit output current high-level short-circuit output current threshold input current, high to low threshold input voltage, low to high input current hysteresis symbol v f ? v f / ? t a i r c t v ol v oh i ccl i cch i osl i osh i fhl v flh i hys note (note 2) (note 1) (note 1) test circuit fig. 12.1.1 fig. 12.1.2 fig. 12.1.3 fig. 12.1.4 fig. 12.1.5 fig. 12.1.6 test condition i f = 10 ma, t a = 25 i f = 10 ma v r = 5 v, t a = 25 v = 0 v, f = 1 mhz i ol = 3.5 ma, i f = 5 ma v cc = 4.5 v, i o = -2.6 ma, v f = 0.8 v v cc = 20 v, i o = -2.6 ma, v f = 0.8 v v cc = 5.5 v, i f = 5 ma v cc = 20 v, i f = 5 ma v cc = 5.5 v, v f = 0 v v cc = 20 v, v f = 0 v v cc = v o = 5.5 v, i f = 5 ma v cc = v o = 20 v, i f = 5 ma v cc = 5.5 v, v f = 0 v, v o = gnd v cc = 20 v, v f = 0 v, v o = gnd i o = 3.5 ma, v o < 0.6 v i o = -2.6 ma, v o > 2.4 v v cc = 5 v min 1.40 2.7 17.4 15 20 -5 -10 0.8 typ. 1.57 -1.8 60 0.2 3.5 19 80 90 -15 -20 0.4 0.05 max 1.80 10 0.6 3.0 3.0 3.0 3.0 1.6 unit v mv/ a pf v ma v ma note: all typical values are at t a = 25 . note 1: duration of output short circuit time should not exceed 10 ms. note 2: v oh = v cc - v o (v) 10. 10. 10. 10. isolation characteristics isolation characteristics isolation characteristics isolation characteristics unless otherwise specified, t a = 25 characteristics capacitance (input to output) isolation resistance isolation voltage symbol c s r s bv s note (note 1) (note 1) test conditions v s = 0 v, f = 1 mhz v s = 500 v, r.h. 60% ac, 1 min ac, 1 s in oil dc, 1 min in oil min 1 10 12 3750 typ. 1.0 10 14 10000 10000 max unit pf ? vrms v dc note 1: this device is considered as a two-terminal device: pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together.
2010-08-12 rev.1.0 TLP2408 5 11. 11. 11. 11. switching characteristics (note) switching characteristics (note) switching characteristics (note) switching characteristics (note) unless otherwise specified, t a = -40 to 100 , v cc = 4.5 to 20 v characteristics propagation delay time to logic low output propagation delay time to logic high output pulse width distortion fall time rise time common-mode transient immunity at output high common-mode transient immunity at output low symbol t phl t plh |t phl - t plh | t f t r cm h cm l note test circuit fig. 12.1.7, fig. 12.1.8 fig. 12.1.9 test condition i f = 0 3 ma i f = 3 0 ma i f = 0 3 ma, v cc = 5 v i f = 3 0 ma, v cc = 5 v v cm = 1000 v p-p , i f = 0 ma, v cc = 20 v, t a = 25 v cm = 1000 v p-p , i f = 5 ma, v cc = 20 v, t a = 25 min 30 30 15 -15 typ. 100 110 30 30 max 250 250 220 75 75 unit ns kv/ s note: all typical values are at t a = 25 .
2010-08-12 rev.1.0 TLP2408 6 12. 12. 12. 12. test circuits and characteristics curves test circuits and characteristics curves test circuits and characteristics curves test circuits and characteristics curves 12.1. 12.1. 12.1. 12.1. test circuits test circuits test circuits test circuits fig. fig. fig. fig. 12.1.1 12.1.1 12.1.1 12.1.1 v v v v ol ol ol ol test circuit test circuit test circuit test circuit fig. fig. fig. fig. 12.1.2 12.1.2 12.1.2 12.1.2 v v v v oh oh oh oh test circuit test circuit test circuit test circuit fig. fig. fig. fig. 12.1.3 12.1.3 12.1.3 12.1.3 i i i i ccl ccl ccl ccl test circuit test circuit test circuit test circuit fig. fig. fig. fig. 12.1.4 12.1.4 12.1.4 12.1.4 i i i i cch cch cch cch test circuit test circuit test circuit test circuit fig. fig. fig. fig. 12.1.5 12.1.5 12.1.5 12.1.5 i i i i osl osl osl osl test circuit test circuit test circuit test circuit fig. fig. fig. fig. 12.1.6 12.1.6 12.1.6 12.1.6 i i i i osh osh osh osh test circuit test circuit test circuit test circuit
2010-08-12 rev.1.0 TLP2408 7 fig. fig. fig. fig. 12.1.7 12.1.7 12.1.7 12.1.7 switching time test circuit switching time test circuit switching time test circuit switching time test circuit fig. fig. fig. fig. 12.1.8 12.1.8 12.1.8 12.1.8 switching time test circuit switching time test circuit switching time test circuit switching time test circuit fig. fig. fig. fig. 12.1.9 12.1.9 12.1.9 12.1.9 common-mode transient immunity test circuit common-mode transient immunity test circuit common-mode transient immunity test circuit common-mode transient immunity test circuit
2010-08-12 rev.1.0 TLP2408 8 13. 13. 13. 13. soldering and storage soldering and storage soldering and storage soldering and storage 13.1. 13.1. 13.1. 13.1. precautions for soldering precautions for soldering precautions for soldering precautions for soldering the soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. ? when using soldering reflow (see fig. 13.1.1 and 13.1.2) reflow soldering must be performed once or twice. the mounting should be completed with the interval from the first to the last mountings being 2 weeks. fig. fig. fig. fig. 13.1.1 13.1.1 13.1.1 13.1.1 an example of a temperature profile an example of a temperature profile an example of a temperature profile an example of a temperature profile when sn-pb eutectic solder is used when sn-pb eutectic solder is used when sn-pb eutectic solder is used when sn-pb eutectic solder is used fig. fig. fig. fig. 13.1.2 13.1.2 13.1.2 13.1.2 an example of a temperature profile an example of a temperature profile an example of a temperature profile an example of a temperature profile when lead(pb)-free solder is used when lead(pb)-free solder is used when lead(pb)-free solder is used when lead(pb)-free solder is used ? when using soldering flow (applicable to both eutectic solder and lead(pb)-free solder) apply preheating of 150 for 60 to 120 seconds. mounting condition of 260 within 10 seconds is recommended. flow soldering must be performed once. ? when using soldering iron (applicable to both eutectic solder and lead(pb)-free solder) complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not exceeding 350 heating by soldering iron must be done only once per lead. 13.2. 13.2. 13.2. 13.2. precautions for general storage precautions for general storage precautions for general storage precautions for general storage ? avoid storage locations where devices may be exposed to moisture or direct sunlight. ? follow the precautions printed on the packing label of the device for transportation and storage. ? keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%, respectively. ? do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. ? store the products in locations with minimal temperature fluctuations. rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. ? when restoring devices after removal from their packing, use anti-static containers. ? do not allow loads to be applied directly to devices while they are in storage. ? if devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use.
2010-08-12 rev.1.0 TLP2408 9 14. 14. 14. 14. land pattern dimensions for reference only land pattern dimensions for reference only land pattern dimensions for reference only land pattern dimensions for reference only fig. fig. fig. fig. 14.1 14.1 14.1 14.1 land pattern dimensions for reference only land pattern dimensions for reference only land pattern dimensions for reference only land pattern dimensions for reference only 15. 15. 15. 15. marking marking marking marking fig. fig. fig. fig. 15.1 15.1 15.1 15.1 marking marking marking marking
2010-08-12 rev.1.0 TLP2408 10 16. 16. 16. 16. en60747-5-2 option (v4) specification en60747-5-2 option (v4) specification en60747-5-2 option (v4) specification en60747-5-2 option (v4) specification ? part number: TLP2408(f) (note) (note) (note) (note) ? the following part naming conventions are used for the devices that have been qualified according to option (v4) of en60747. example:TLP2408(v4-tpl,f) v4: en60747 option tpl: tape and reel type f: [[g]]/rohs compatible (note 1) (note 1) (note 1) (note 1) note: use toshiba standard type number for safety standard application. e.g., TLP2408(v4-tpl,f) TLP2408 note 1: please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of product. rohs is the directive 2002/95/ec of the european parliament and of the council of 27 january 2003 on the restriction of the use of certain hazardous substances in electrical and electronics equipment. fig. fig. fig. fig. 16.1 16.1 16.1 16.1 en60747 isulation characteristics en60747 isulation characteristics en60747 isulation characteristics en60747 isulation characteristics
2010-08-12 rev.1.0 TLP2408 11 fig. fig. fig. fig. 16.2 16.2 16.2 16.2 insulation related specifications (note) insulation related specifications (note) insulation related specifications (note) insulation related specifications (note) note: if a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e. g., at a standard distance between soldering eye centres of 3.5mm). if this is not permissible, the user shall take suitable measures. note: this photocoupler is suitable for safe electrical isolation safe electrical isolation safe electrical isolation safe electrical isolation only within the safety limit data. maintenance of the safety data shall be ensured by means of protective circuits. fig. fig. fig. fig. 16.3 16.3 16.3 16.3 marking example (note) marking example (note) marking example (note) marking example (note) note: the above marking is applied to the photocouplers that have been qualified according to option (v4) of en60747.
2010-08-12 rev.1.0 TLP2408 12 fig. fig. fig. fig. 16.4 16.4 16.4 16.4 test results test results test results test results
2010-08-12 rev.1.0 TLP2408 13 package dimensions package dimensions package dimensions package dimensions unit: mm weight: 0.11 g (typ.) package name(s) toshiba: 11-5k1s nickname: so8
2010-08-12 rev.1.0 TLP2408 14 restrictions on product use restrictions on product use restrictions on product use restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collectively "toshiba"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduced without prior written permission from toshiba. even with toshiba's written permission, reproduction is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and conditions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be used with or for. customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. toshiba assumes no liability for customers' product design or applications. toshiba assumes no liability for customers' product design or applications. toshiba assumes no liability for customers' product design or applications. ? product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/ or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact ("unintended use"). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in this document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is presented only as guidance for product use. no responsibility is assumed by toshiba for any infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provided in the relevant terms and conditions of sale absent a written signed agreement, except as provided in the relevant terms and conditions of sale absent a written signed agreement, except as provided in the relevant terms and conditions of sale absent a written signed agreement, except as provided in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, consequential, special, or incidental damages or loss, including including without limitation, indirect, consequential, special, or incidental damages or loss, including including without limitation, indirect, consequential, special, or incidental damages or loss, including including without limitation, indirect, consequential, special, or incidental damages or loss, including without limitation, loss of profits, loss of opportunities, business interruption and loss of data, and without limitation, loss of profits, loss of opportunities, business interruption and loss of data, and without limitation, loss of profits, loss of opportunities, business interruption and loss of data, and without limitation, loss of profits, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular or information, including warranties or conditions of merchantability, fitness for a particular or information, including warranties or conditions of merchantability, fitness for a particular or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. purpose, accuracy of information, or noninfringement. purpose, accuracy of information, or noninfringement. purpose, accuracy of information, or noninfringement. ? gaas (gallium arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwise make available product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. export administration regulations. export and re-export of product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of product. please use product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.

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